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Minggu, 08 Maret 2015

OPTICAL INTERCONNECTS part 2



IMPEDANCE MISMATCHING

Considering just board-to-board interconnects for a moment leads us to address the problem of impedance mismatching.   In a practical computer/router system, the electronic boards are plugged into a backplane which connects the many boards to each other.   A signal generated on one board, for example, must pass through the ball grid array on the transmitter chip onto the printed circuit board (PCB), travel along a metal trace on the board to the edge, cross over to the backplane through a connector, along the backplane, through another connector, along another board, and through another ball grid array contact in order to arrive at the receiver circuit.  At each interface, two traces come together in a way that is likely to contain some discontinuities in the size and shape of the joint between them.   Electrical signals passing through such discontinuities generate reflections due to the impedance mismatch at the interface [2, 7].  It is essential that these reflections be minimized because they can cause intersymbol interference (ISI).   ISI means the information in one bit is corrupted somewhat by the energy or information in some other bit(s) in the data stream.  ISI, in this case, is essentially an echo’ the first part of a signal tries to pass these interfaces, but some of the energy is reflected and when it comes back in the same direction a split second later, this ‘echo gets superimposed with the signal that is currently trying to pass the interface for the first time.  Clearly, the ability of the receiver to properly distinguish the original information in the signal will be compromised somewhat by this echo, just as it is difficult to understand the speech of someone who is standing in a strongly echoing environment, like a shower room.  (Note that reflections are not the only cause of ISI.   Other channel imperfections, such as dispersion, can lead to ISI as the energy from one bit corrupts the adjacent bits in time. Regardless of its source, ISI should be minimized and it is significantly more problematic in electronic channels than in optical channels, as we will see.)


CROSS-TALK

As the highest frequency in an electrical signal approaches 5-10 GHz, a wire with an oscillating electric field at that frequency will be emitting radiation that will be picked up by nearby wires.   Thus, a signal that is supposed to be confined to one wire will actually be contributing to the energy or signal carried on another wire.  This cross-talk”

is obviously noise on the receiving signal that degrades the ability of the receiver circuit to properly distinguish the digital levels.  The large amount of data that must pass through a chip’s I/O necessitates a dense array of interconnects.   If an electrical interconnect scheme is utilized, this provides so many opportunities for cross-talk that each line must be well protected.

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